Using picosecond laser, ultra short pulse processing with almost no heat conduction, suitable for high-speed cutting and drilling of any organic and inorganic material, with a minimum edge collapse and heat affected zone of 3 μ m. The materials that can be processed include silver paste ITO、Cu、 Glass, sapphire, ceramics, ultra-thin metal sheets, polymer composite materials, silicon wafers, as well as various alloy materials and thin film materials. CCD visual pre scanning&automatic target positioning, maximum processing range of 500 × 400m, XY platform splicing accuracy of ≤± 3 μ m. Excellent beam quality and good long-term stability.