This machine is a laser etching device with a CCD vision system, equipped with a visual magnification system and auxiliary positioning function, which can greatly improve etching accuracy and repeatability, reduce etching differences between substrates, and is suitable for perovskite devices OLED、ITO/FTO、 The high-precision etching and marking of flexible conductive substrates can also be used for the removal, marking, and cutting of other thin films and silicon wafers, and can complete the P1/P2/P3/P4 processes of perovskite cells.